MUR1620CTRG Datasheet, PDF (5/6 Pages) ON Semiconductor – Switch Mode Power Rectifier

MUR1620CTRG, MURB1620CTRG, NRVUB1620CTRT4G
PACKAGE DIMENSIONS
L1
H
e
NOTE 6
E
E2
TOP VIEW
D²PAK−3 (TO−263, 3−LEAD)
CASE 418AJ
ISSUE B
A
A
NOTE 3
D
B
SEATING
PLANE
c2
A
D1
DETAIL C
L1
E1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. CHAMFER OPTIONAL
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH. MOLD FLASH SHALL NOT EXCEED 0.005
PER SIDE. THESE DIMENSIONS ARE MEASURED
AT THE OUTERMOST EXTREMES OF THE PLAS-
TIC BODY AT DATUM H.
5. THERMAL PAD CONTOUR IS OPTIONAL WITHIN
DIMENSIONS E, L1, D1 AND E1.
6. OPTIONAL MOLD FEATURE
L2
A
c
2X b
SIDE VIEW
0.10 M B A M
0.10 M B A M
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.160 0.190 4.06 4.83
A1 0.000 0.010 0.00 0.25
VIEW A−A
b 0.020 0.039 0.51 0.99
c 0.012 0.029 0.30 0.74
c2 0.045 0.065 1.14 1.65
GAUGE
H
D 0.330 0.380 8.38 9.65
D1 0.260 −−−− 6.60 −−−−
PLANE
E 0.380 0.420 9.65 10.67
L3
E1 0.245 −−−− 6.22 −−−−
e 0.100 BSC
2.54 BSC
H 0.575 0.625 14.60 15.88
L 0.070 0.110 1.78 2.79
L1 −−−− 0.066 −−−− 1.68
M
L
A1
DETAIL C
B
SEATING
PLANE
L2 −−−− 0.070 −−−− 1.78
L3 0.010 BSC
0.25 BSC
M 0°
8°
0°
8°
VIEW A−A
OPTIONAL CONSTRUCTIONS
RECOMMENDED
SOLDERING FOOTPRINT*
0.436
0.653
0.366
2X
0.169
2X
0.063
0.100
PITCH
DIMENSIONS: INCHES
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
5