LV5239TA Datasheet, PDF (5/28 Pages) ON Semiconductor – 24-channel LED Driver

Package Dimensions
unit : mm
LV5239TA
TQFP48 EP 7x7, 0.5P
CASE 932F
ISSUE C
37
NOTE 7
A
NOTES
4 & 6 _E1
NOTE 9
D
NOTE 7
D
25
4X 12 TIPS
0.20 C A-B D
NOTE 7
B
NOTE 9
E
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR
PROTRUSION SHALL BE 0.08 MAX. AT MMC. DAMBAR CANNOT BE
LOCATED ON THE LOWER RADIUS OF THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSION AND ADJACENT LEAD IS 0.07.
SIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE
BURRS SHALL NOT EXCEED 0.25 PER SIDE. DIMENSIONS D1 AND E1
ARE MAXIMUM PLASTIC BODY SIZE INCLUDING MOLD MISMATCH.
5. THE TOP PACKAGE BODY SIZE MAY BE SMALLER THAN THE BOTTOM
PACKAGE SIZE BY AS MUCH AS 0.15.
6. DATUMS A-B AND D ARE DETERMINED AT DATUM PLANE H.
7. A1 IS DEFINED AS THE VERTICAL DISTANCE FROM THE SEATING
8. DIMENSIONS D AND E TO BE DETERMINED AT DATUM PLANE C.
48
13
0.08 C
1
D1
NOTES 4 & 6
TOP VIEW
DETAIL A
4X
0.20 H A-B D
H
A
A2
0.05
e
48X b
C
SEATING
PLANE
0.20 C A-B D
SIDE VIEW
NOTE 3
A1
L
DETAIL A
MILLIMETERS
DIM MIN MAX
A 0.95 1.25
A1 0.05 0.15
A2 0.90 1.20
b 0.17 0.27
D
9.00 BSC
D1 7.00 BSC
D2 4.90 5.10
E
9.00 BSC
E1 7.00 BSC
L2
E2 4.90 5.10
e
0.50 BSC
L 0.45 0.75
L2 0.25 BSC
M
0°
7°
M
GENERIC
MARKING DIAGRAM*
D2
BOTTOM VIEW
XXXXXXXXXX
XXXXXXXXXX
AWLYYWWG
RECOMMENDED
SOLDERING FOOTPRINT*
E2
9.36
48X
5.30
1.13
1
XXXXX = Specific Device Code
A
= Assembly Location
WL = Wafer Lot
YY
= Year
WW = Work Week
G
= Pb Free Package
5.30
9.36 _{*This information is generic. Please refer to}
device data sheet for actual part marking.
1
0.50
PITCH
48X
0.29
DIMENSIONS: MILLIMETERS
*For additional information on our Pb Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
5