CS1009 Datasheet, PDF (5/8 Pages) ON Semiconductor – 2.5 Volt Reference

CS1009
–X–
A
PACKAGE DIMENSIONS
SO–8
D SUFFIX
CASE 751–07
ISSUE V
8
5
B
S
0.25 (0.010) M Y M
1
4
–Y–
K
G
–Z–
C
SEATING
PLANE
N X 45 _{_}
H
D
0.10 (0.004)
M
J
0.25 (0.010) M Z Y S X S
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 4.80 5.00 0.189 0.197
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G
1.27 BSC
0.050 BSC
H 0.10 0.25 0.004 0.010
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050
M 0_{_} 8_{_} 0_{_} 8_{_}
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
A
R
SEATING
PLANE
B
P
L
K
XX
G
H
V
C
1
N
N
TO–92
Z SUFFIX
CASE 29–11
ISSUE AL
D
J
SECTION X–X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
INCHES
DIM MIN MAX
A 0.175 0.205
B 0.170 0.210
C 0.125 0.165
D 0.016 0.021
G 0.045 0.055
H 0.095 0.105
J 0.015 0.020
K 0.500 ---
L 0.250 ---
N 0.080 0.105
P --- 0.100
R 0.115 ---
V 0.135 ---
MILLIMETERS
MIN MAX
4.45 5.20
4.32 5.33
3.18 4.19
0.407 0.533
1.15 1.39
2.42 2.66
0.39 0.50
12.70 ---
6.35 ---
2.04 2.66
--- 2.54
2.93 ---
3.43 ---
PACKAGE THERMAL DATA
Parameter
R_ΘJC
R_ΘJA
Typical
Typical
SO–8
45
165
TO–92
–
170
Unit
°C/W
°C/W
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