CS1009 Datasheet, PDF (3/8 Pages) ON Semiconductor – 2.5 Volt Reference

CS1009
MAXIMUM RATINGS*
Rating
Value
Unit
Reverse Current
20
mA
Forward
10
mA
Operating Temperature Range
–40 to 105
°C
Storage Temperature Range
–65 to +150 °C
Lead Temperature Soldering:
Wave Solder (through hole styles only) (Note 1) 260 peak
°C
Reflow: (SMD styles only) (Note 2) 230 peak
°C
1. 10 second maximum
2. 60 second maximum above 183°C.
*The maximum package power dissipation must be observed.
ELECTRICAL CHARACTERISTICS (T_A = 25°C unless otherwise specified.)
Characteristic
Test Conditions
Min
Typ
Max
Reverse Breakdown Voltage
Reverse Breakdown Voltage
Reverse Breakdown Voltage
Reverse Breakdown Voltage
Change with Current
I_R = 1.0 mA
0°C ≤ T_A ≤ 105°C
–40°C ≤ T_A ≤ °C
400 µA ≤ I_R ≤ 10 mA
2.492
2.500
2.508
2.492
2.500
2.508
2.480
2.500
2.508
–
2.6
10
{
–
3.0
12
Reverse Dynamic Impedance
I_R = 1.0 mA
–
0.2
1.0
{
–
0.4
1.4
Temperature Stability
Avgerage Temperature Coefficient
0°C ≤ T_A ≤ 70°C, Note 3
0°C ≤ T_A ≤ 70°C, Note 3
Long Term Stabilty
T_A = 25°C ±0.1 C, I_R = 1.0 mA
† Denotes the specifications which apply over full operating temperature range.
–
–
–
–
–
–
–
20
–
3. Average temperature coefficient is defined as the total voltage change divided by the specified temperature range.
Unit
V
V
V
mV
mV
Ω
Ω
mV
ppm/°C
ppm/kHr
TYPICAL PERFORMANCE CHARACTERISTICS
10^–1
5
10^–2
10^–3
10^–4
10^–5
T_J = 25°C
0.5
1.0
1.4
1.8
2.2
2.6
REVERSE VOLTAGE (V)
Figure 3. Reverse Current vs. Reverse Voltage
4
3
2
1
0
0
4
8
12
16
20
REVERSE VOLTAGE (V)
Figure 4. Change in Reverse Voltage vs.
Reverse Current
http://onsemi.com
3