CM2006 Datasheet, PDF (5/9 Pages) California Micro Devices Corp – VGA Port Companion Circuit For Monitors

CM2006
ELECTRICAL OPERATING CHARACTERISTICS ^{(SEE NOTE 1)}
SYMBOL PARAMETER
I_{CC_DDC}
I_CC
V_{CC_DDC} Supply Current
V_CC Supply Current
CONDITIONS
V_{CC_DDC} = 5.0V
V_CC = 5V; SYNC inputs at GND or V_CC;
SYNC outputs unloaded
V_CC = 5V; SYNC inputs at 3.0V;
SYNC outputs unloaded
V_F
V_IH
V_IL
V_HYS
V_OH
V_OL
R_OUT
I_IN
I_OFF
I_BACKDRIVE
V_ON
C_{IN_VID}
t_PLH
ESD Diode Forward Voltage
Logic High Input Voltage
I_F = 10mA
V_CC = 5.0V; Note 2
Logic Low Input Voltage
V_CC = 5.0V; Note 2
Hysteresis Voltage
V_CC = 5.0V; Note 2
Logic High Output Voltage
I_OH = 0mA, V_CC = 5.0V; Note 2
Logic Low Output Voltage
I_OL = 0mA, V_CC = 5.0V; Note 2
SYNC Driver Output Resistance
V_CC = 5.0V; SYNC Inputs at GND or 3.0V
Input Current
VIDEO Inputs
SYNC_IN1, SYNC_IN2 Inputs
V_CC = 5.0V; V_IN = V_CC or GND
V_CC = 5.0V; V_IN = V_CC or GND
Level Shifting N-MOSFET "OFF" State
Leakage Current
(V - V ) 0.4V; V = V _{CC_DDC}
DDC_IN
DDC_OUT
CC_DDC
(V - V ) 0.4V; V = V _{CC_DDC}
DDC_OUT
DDC_IN
CC_DDC
Current conducted from input pins when Vcc V_CC < V Note _{INPUT_PIN ;} 5
is powered down.
Voltage Drop Across Level-shifting
N-MOSFET when "ON"
V_{CC_DDC} = 2.5V; V_S = GND; I_DS = 3mA;
VIDEO Input Capacitance
V_CC = 5.0V; V_IN = 2.5V; f = 1MHz
V_CC = 2.5V; V_IN = 1.25V; f = 1MHz
SYNC Driver L => H Propagation Delay
C_L = 50pF; V_CC = 5.0V; Input t_R and t_F 5ns
t_PHL
SYNC Driver H => L Propagation Delay
C_L = 50pF; V_CC = 5.0V; Input t_R and t_F 5ns
MIN TYP MAX UNITS
10 µA
1 mA
2.0 mA
1.0 V
2.0
V
0.5 V
400
mV
4.0
V
0.15 V
7 15 24 Ω
±10 µA
±10 µA
10 µA
10 µA
10
µA
0.18 V
3 pF
3.5 pF
12 ns
12 ns
t_R, t_F
SYNC Driver Output Rise & Fall Times
C_L = 50pF; V_CC = 5.0V; Input t_R and t_F 5ns
3
ns
V_ESD1
V_ESD
ESD Withstand Voltage, Sync_out pins only V_CC = 5V; Notes 3 and 4
ESD Withstand Voltage
V_CC = 5V; Notes 3 and 5
±2
kV
±8
kV
Note 1: All parameters specified over standard operating conditions unless otherwise noted.
Note 2: These parameters apply only to the SYNC drivers. Note that R_OUT = R_T + R . _BUFFER
Note 3: Per the IEC-61000-4-2 International ESD Standard, Level 4 contact discharge method. BYP and V_CC must be bypassed to
GND via a low impedance ground plane with a 0.22µF, low inductance, chip ceramic capacitor at each supply pin. ESD
pulse is applied between the applicable pins and GND. ESD pulses can be positive or negative with respect to GND.
Applicable pins are: VIDEO_1, VIDEO_2, VIDEO_3, SYNC_IN1, SYNC_IN2, DDC_IN1 and DDC_IN2. All pins are ESD
protected to the industry standard ±2kV Human Body Model (MIL-STD-883, Method 3015).
Note 4: This specification applies to the SYNC_OUT pins only.
Note 5: Applicable pins are: VIDEO_1, VIDEO_2, VIDEO_3, SYNC_IN1, SYNC_IN2, DDC_IN1 and DDC_IN2.
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