LC898123F40XC_16 Datasheet, PDF (4/11 Pages) ON Semiconductor – Optical Image Stabilization (OIS) / Auto Focus (AF) Controller & Driver

5. Package Dimensions
unit : mm
LC898123F40XC
WLCSP35, 3.22x2.3
CASE 567LJ
ISSUE O
E
PIN A1
REFERENCE
2X
0.10 C
2X
0.10 C
TOP VIEW
0.10 C
0.08 C
NOTE 3
SIDE VIEW
e
35X b
0.05 C A B
G
0.03 C
F
E
D
C
B
A
123 45
BOTTOM VIEW
AB
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A
0.45
A1 0.03 0.13
b 0.15 0.25
D
3.22 BSC
E
2.30 BSC
e
0.40 BSC
A
A1
C
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
e
0.40
PITCH
35X
0.20
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
4