CSPEMI201AG_11 Datasheet, PDF (4/5 Pages) ON Semiconductor – 2 Channel Headset Speaker EMI Filter

CSPEMI201AG
APPLICATION INFORMATION
Parameter
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance − Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste
Value
0.240 mm
Round
Non−Solder Mask defined pads
0.290 mm Round
0.125 mm − 0.150 mm
0.300 mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
±50 mm
±20 mm
60 seconds
260°C
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 3. Recommended Non−Solder Mask Defined Pad Illustration
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 4. Lead−free (SnAgCu) Solder Ball Reflow Profile
http://onsemi.com
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