English
Language : 

CM1205_11 Datasheet, PDF (4/5 Pages) ON Semiconductor – 8-Channel ESD Protection Array in Chip Scale Package
CM1205
MECHANICAL SPECIFICATIONS
The CM1205−08CP is offered in a 10−bump custom Chip Scale Package (CSP). Dimensions are presented below.
Table 5. CSP TAPE AND REEL SPECIFICATIONS
Part Number
CM1205−08CP
Chip Size (mm)
3.104 X 1.154 X 0.682
Pocket Size (mm)
B0 X A0 X K0
3.28 X 1.32 X 0.81
Tape Width
W
8 mm
Reel Diameter
178 mm (7″)
Qty per
Reel
3500
P0
P1
4 mm 4 mm
Top
Cover
Tape
Ko
Po
Ao
+
+
Bo
For Tape Feeder Reference
Only Including Draft,
Concerning around B.
Embossment
P1
User Direction of Feed
10 Pitches Cumulative
Tolerance On Tape
±0.2 mm
+
W
Center Lines
of Cavity
http://onsemi.com
4