AMIS-39100 Datasheet, PDF (4/12 Pages) AMI SEMICONDUCTOR – Octal High Side Driver with Protection

AMIS−39100
Table 2. ABSOLUTE MAXIMUM RATINGS
Symbol
Description
Min
Max
Unit
VDDN
Power Supply Voltage
GND − 0.3
6
V
VB
DC Battery Supply on Pins VB1 to VB4 Load Dump, Pulse 5b 400 ms
GND − 0.3
35
V
Iout_ON
Maximum Output Current OUTx Pins (Note 1)
The HS Driver is Switched On
−3000
350
mA
Iout_OFF Maximum Output Current OUTx Pins (Note 1)
The HS Driver is Switched Off
−350
350
mA
I_OUT_VB Maximum Output Current VB1, 2, 3, 4 Pins
−700
3750
mA
Vcapa1
DC Voltage on Pins capa1
0
VB + 16.5
V
Vdig_in
V_ESD
Voltage on Digital Inputs CLK, PDB, WR, DIN
Pins that Connect the Application (Pins VB1 − 8 and Out1 − 8) (Note 2)
All Other Pins (Note 2)
−0.3
−4
−2
V_DDN + 0.3
V
+4
kV
+2
V_ESD
ESD According Charged Device Model (Note 3)
−750
+750
V
T_J
Junction Temperature (T < 100 hours)
−40
175
°C
Tmr
Ambient Temperature Under Bias
−40
105
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The power dissipation of the chip must be limited not to exceed the maximum junction temperature Tj.
2. According to Human Body Model (HBM) standard MIL−STD−883 method 3015.7
3. According to norm EOS/ESD−STM5.3.1−1999 robotic mode
Table 3. THERMAL CHARACTERISTICS OF THE PACKAGE
Symbol
Description
R_{th(vj−a)}
Thermal Resistance from Junction−to−Ambient in Power SOIC 28 Package
Conditions
In Free Air
Value
145
Unit
K/W
Table 4. THERMAL CHARACTERISTICS OF THE AMIS−39100 ON A PCB
PCB Design
Conductivity Top and Bottom Layer
R_thja
(Note 4)
Unit
Two Layer (35 mm) Copper Planes According Figure 3 to +25% Popper for the Remaining Areas
24
K/W
Two Layer (35 mm) Copper Planes According to Figure 3 0% Popper for the Remaining Areas
53
K/W
Four Layer JEDEC: 25% Copper Coverage
EIA/JESD51−7
25
K/W
One Layer JEDEC: 25% Copper Coverage
EIA/JESD51−3
46
K/W
4. These values are informative only.
R_thja = Thermal Resistance from Junction−to−Ambient
Table 5. OPERATING RANGES
Symbol
Description
Min
Max
Unit
V_DDN
Vdig_in
VB
(Note 5)
Digital Power Supply Voltage
Voltage on Digital Inputs CLK, PDB, WR, DIN
DC Battery Supply on Pins VB1 to VB4
3.1
5.5
V
−0.3
V_DDN
V
3.5
16
V
T_A
Ambient Temperature
−40
105
°C
5. The power dissipation of the chip must be limited not to exceed maximum junction temperature T_J of 130°C.
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