74HC125 Datasheet, PDF (4/8 Pages) NXP Semiconductors – Quad buffer/line driver; 3-state

74HC125
AC ELECTRICAL CHARACTERISTICS (C_L = 50 pF, Input t_r = t_f = 6.0 ns)
Guaranteed Limit
Symbol
Parameter
V_CC ^{– 55 to}
(V)
25_C v 85_C v 125_C _Unit
t_PLH,
t_PHL
Maximum Propagation Delay, Input A to Output Y
(Figures 1 and 3)
2.0
90
3.0
36
4.5
18
6.0
15
115
135
ns
45
60
23
27
20
23
t_PLZ,
t_PHZ
Maximum Propagation Delay, Output Enable to Y
(Figures 2 and 4)
2.0
120
150
180
ns
3.0
45
60
80
4.5
24
30
36
6.0
20
26
31
t_PZL,
t_PZH
Maximum Propagation Delay, Output Enable to Y
(Figures 2 and 4)
2.0
90
3.0
36
4.5
18
6.0
15
115
135
ns
45
60
23
27
20
23
t_TLH,
t_THL
Maximum Output Transition Time, Any Output
(Figures 1 and 3)
2.0
60
75
90
ns
3.0
22
28
34
4.5
12
15
18
6.0
10
13
15
C_in Maximum Input Capacitance
−
10
10
10
pF
C_out Maximum 3−State Output Capacitance (Output in High−Impedance State) −
15
15
15
pF
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON
Semiconductor High−Speed CMOS Data Book (DL129/D).
Typical @ 25°C, V_CC = 5.0 V
C_PD Power Dissipation Capacitance (Per Buffer)*
30
pF
* Used to determine the no−load dynamic power consumption: P_D = C_PD V_CC2f + I_CC V_CC. For load considerations, see Chapter 2 of the
ON Semiconductor High−Speed CMOS Data Book (DL129/D).
ORDERING INFORMATION
Device
Package
Shipping^†
74HC125DR2G
SOIC−14
(Pb−Free)
2500 / Tape & Reel
74HC125DTR2G
TSSOP−14*
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
http://onsemi.com
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