NOII5SM1300A Datasheet, PDF (31/33 Pages) ON Semiconductor – IBIS5 1.3 Megapixel CMOS Image Sensor

NOII5SM1300A
Table 27. MECHANICAL SPECIFICATIONS (see Package Drawing with Glass on page 30)
Parameters
Description
Min
Die (with Pin 1 to the left Die thickness
NA
center, Top View)
Pixel (0,0) is bottom left ^{Die center, X offset to the center of package}
–50
Die center, Y offset to the center of the package
–50
Die position, X tilt to the Die Attach Plane
N/A
Die position, Y tilt to the Die Attach Plane
N/A
Die placement accuracy (referenced to die scribe and lead fingers
–50
on package on all four sides)
Die rotation accuracy
–1
Distance from PCB plane to top of the die surface
–
Distance from top of the die surface to top of the glass lid
–
Glass lid specifications XY size
–
Thickness
0.5
Spectral range for optical coating of window
400
Reflection coefficient for window (refer to Figure 31)
–
Mechanical shock
JESD22-B104C; Condition G
–
Vibration
JESD22-B103B; Condition 1
20
Mounting profile
Reflow profile according to J-STD-020D.1
–
Typ
Max
0.740
NA
0
50
0
50
1
N/A
1
N/A
0
50
–
1.26
1.69
15 x 15
0.55
–
<0.8
–
–
–
1
–
–
–
0.6
1000
2000
2000
260
Units
mm
mm
mm
deg
deg
mm
deg
mm
mm
mm
mm
nm
%
G
Hz
°C
Figure 30. Side View Dimensions
http://onsemi.com
31