RB521S30T1 Datasheet, PDF (3/4 Pages) ON Semiconductor – Schottky Barrier Diode

RB521S30T1
PACKAGE DIMENSIONS
SOD−523
PLASTIC PACKAGE
CASE 502−01
ISSUE O
−X−
A
−Y−
B
D 2 PL
0.08 (0.003) M T X Y
C
K
−T−
J
SEATING
S
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
MILLIMETERS
INCHES
DIM MIN NOM MAX MIN NOM MAX
A 1.10 1.20 1.30 0.043 0.047 0.051
B 0.70 0.80 0.90 0.028 0.032 0.035
C 0.50 0.60 0.70 0.020 0.024 0.028
D 0.25 0.30 0.35 0.010 0.012 0.014
J 0.07 0.14 0.20 0.0028 0.0055 0.0079
K 0.15 0.20 0.25 0.006 0.008 0.010
S 1.50 1.60 1.70 0.059 0.063 0.067
RECOMMENDED FOOTPRINT
1.4
0.0551
0.4
0.0157
0.4
0.0157
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