MMDL301 Datasheet, PDF (3/4 Pages) ON Semiconductor – Silicon Hot-Carrier Diodes

MMDL301T1
PACKAGE DIMENSIONS
K
A
D
1
2
B
J
H
NOTE 3
SOD–323
PLASTIC PACKAGE
CASE 477–02
ISSUE A
E
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING
WITH SOLDER PLATING.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 1.60 1.80 0.063 0.071
B 1.15 1.35 0.045 0.053
C 0.80 1.00 0.031 0.039
D 0.25 0.40 0.010 0.016
E
0.15 REF
0.006 REF
H 0.00 0.10 0.000 0.004
J 0.089 0.177 0.0035 0.0070
K 2.30 2.70 0.091 0.106
STYLE 1:
PIN 1. CATHODE
2. ANODE
0.63Ămm
0.025ȀȀ
1.60Ămm
0.063ȀȀ
2.85Ămm
0.112ȀȀ
ǒ mm Ǔ
inches
0.83Ămm
0.033ȀȀ
SOD–323
Soldering Footprint
http://onsemi.com
3