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MMBV3700LT1_06 Datasheet, PDF (3/4 Pages) ON Semiconductor – High Voltage Silicon Pin Diodes | |||
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MMBV3700LT1, MPN3700
PACKAGE DIMENSIONS
SOTâ23 (TOâ236)
CASE 318â08
ISSUE AN
D
SEE VIEW C
3
E
HE
1
2
b
e
A
A1
c
0.25
q
L
L1
VIEW C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318â01 THRU â07 AND â09 OBSOLETE, NEW
STANDARD 318â08.
MILLIMETERS
DIM MIN NOM MAX
A 0.89
1.00
1.11
A1 0.01
0.06
0.10
b 0.37
0.44
0.50
c
0.09
0.13
0.18
D 2.80
2.90
3.04
E 1.20
1.30
1.40
e
1.78
1.90
2.04
L 0.10
0.20
0.30
L1 0.35
0.54
0.69
H E 2.10
2.40
2.64
STYLE 8:
PIN 1. ANODE
2. NO CONNECTION
3. CATHODE
MIN
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.008
0.021
0.094
MAX
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
2.0
0.079
0.9
0.035
0.8
0.031
Ç Ç SCALE 10:1
mm
inches
*For additional information on our PbâFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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