MJF3055 Datasheet, PDF (3/4 Pages) Motorola, Inc – COMPLEMENTARY SILICON POWER TRANSISTORS 10 AMPERES 90 VOLTS 30 WATTS

TEST CONDITIONS FOR ISOLATION TESTS*
MOUNTED
FULLY ISOLATED
CLIP
PACKAGE
LEADS
MOUNTED
FULLY ISOLATED
CLIP
PACKAGE
0.107” MIN
LEADS
MJF3055 MJF2955
MOUNTED
FULLY ISOLATED
PACKAGE
0.107” MIN
LEADS
HEATSINK
0.110” MIN
HEATSINK
Figure 4. Clip Mounting Position
for Isolation Test Number 1
Figure 5. Clip Mounting Position
for Isolation Test Number 2
* Measurement made between leads and heatsink with all leads shorted together
HEATSINK
Figure 6. Screw Mounting Position
for Isolation Test Number 3
MOUNTING INFORMATION
4–40 SCREW
CLIP
PLAIN WASHER
HEATSINK
COMPRESSION WASHER
NUT
HEATSINK
Figure 7. Typical Mounting Techniques*
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw
torque of 6 to 8 in ^. lbs is sufficient to provide maximum power dissipation capability. The compression washer helps to maintain a con-
stant pressure on the package over time and during large temperature excursions.
Destructive laboratory tests show that using a hex head 4–40 screw, without washers, and applying a torque in excess of 20 in ^. lbs will
cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability.
Additional tests on slotted 4–40 screws indicate that the screw slot fails between 15 to 20 in ^. lbs without adversely affecting the pack-
age. However, in order to positively ensure the package integrity of the fully isolated device, Motorola does not recommend exceeding 10
in ^. lbs of mounting torque under any mounting conditions.
** For more information about mounting power semiconductors see Application Note AN1040.
Motorola Bipolar Power Transistor Device Data
3