MC74LVX50 Datasheet, PDF (3/10 Pages) ON Semiconductor – HEX BUFFER

MC74LVX50
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V_CC
V_IN
V_OUT
I_IK
I_OK
I_OUT
I_CC
T_STG
T_L
T_J
q_JA
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
DC Supply Current per Supply Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature under Bias
Thermal Resistance
V_I < GND
V_O < GND
(Note 1)
SOIC
TSSOP
*0.5 to )7.0
*0.5 to )7.0
*0.5 to V_CC )0.5
*20
$20
$25
$50
*65 to )150
260
)150
125
170
V
V
V
mA
mA
mA
mA
_C
_C
_C
_C/W
MSL Moisture Sensitivity
Level 1
F_R
V_ESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 30% − 35% UL 94−V0 @ 0.125 in
Human Body Model (Note 2)
> 2000
V
Machine Model (Note 3)
> 200
Charged Device Model (Note 4)
2000
I_Latchup Latchup Performance
Above V_CC and Below GND at 85_C (Note 5)
$300
mA
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V_CC Supply Voltage
2.0
3.6
V
V_I
Input Voltage
(Note 6)
0
5.5
V
V_O
Output Voltage
(HIGH or LOW State)
0
V_CC
V
T_A
Operating Free−Air Temperature
*40
)85
_C
Dt/DV Input Transition Rise or Fall Rate
V_CC = 3.0 V $0.3 V
0
100
ns/V
6. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level.
NOTE: The q_JA of the package is equal to 1/Derating. Higher junction temperatures may affect the expected lifetime of the device per the table
and figure below.
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