LC898121XA Datasheet, PDF (3/6 Pages) ON Semiconductor – Optical Image Stabilization / Controller & Driver

Package Dimensions
unit : mm
WLCSP40, 2.44x3.94
CASE 567JB
ISSUE O
LC898121XA
PIN A1
REFERENCE
D
AB
E
2X 0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A
−−− 0.65
A1 0.15 0.24
b 0.22 0.32
D
2.44 BSC
E
3.94 BSC
e
0.50 BSC
2X
0.10 C
0.10 C
0.08 C
NOTE 3
TOP VIEW
SIDE VIEW
A
A1
A1
C
SEATING
PLANE
RECOMMENDED
SOLDERING FOOTPRINT*
0.50
PITCH
PACKAGE
OUTLINE
0.50
PITCH
e/2
e
E
D
C
B
A
12 34 567 8
BOTTOM VIEW
40X
0.25
e
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
40X b
0.05 C A B
0.03 C
www.onsemi.com
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