LC898111AXB_15 Datasheet, PDF (3/6 Pages) ON Semiconductor – Optical Image Stabilization (OIS) Controller & Driver

LC898111AXB
Package Dimensions
unit : mm
WLCSP48, 3.22x2.57
CASE 567GE
ISSUE O
D
PIN A1
REFERENCE
2X
0.13 C
2X
0.13 C
0.10 C
TOP VIEW
AB
E
A2
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A
0.69
A1 0.16 0.26
A2
0.43 REF
b 0.21 0.31
D
3.22 BSC
E
2.57 BSC
e
0.40 BSC
GENERIC
MARKING DIAGRAM*
XXXXXXX
XXXXXXX
AWLYYWW
0.08 C
NOTE 3
A1
SIDE VIEW
e/2
e
F
E
D
C
B
A
12 34 5678
BOTTOM VIEW
C
SEATING
PLANE
48X b
0.05 C A B
0.03 C
e/2
e
XXXXXXX = Device Code
A
= Assembly Location
WL
= Wafer Lot
YY
= Year
WW
= Work Week
= Pb-Free Package
*This information is generic. Please refer
to device data sheet for actual part
marking.
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
A1
OUTLINE
0.40
PITCH
0.40
PITCH
48X
0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
3