NOIS1SM0250A Datasheet, PDF (21/25 Pages) ON Semiconductor – Radiation Tolerant CMOS Image Sensor

NOIS1SM0250A
Table 15. MECHANICAL SPECIFICATIONS
Characteristics
Package tolerance
Die position, X offset
Die position, Y offset
Die position, planarity
Die position, Y tilt
Min
–
–0.05
–0.018
–0.05
–0.05
Limits
Typ
–
0
–
0
0
NOTE: Min and Max limits are not measured on every unit, but guaranteed by assembly process.
Max
0.15
0.05
0.118
0.05
0.05
Units
mm
mm
mm
mm
mm
Die Alignment
The die is aligned manually in the package to a tolerance of ±50 mm and the alignment is verified after hardening the die
adhesive. All dimensions in Figure 14 are in mm.
Parallelism in
X and Y within
+ 50 μm
Pin 1
A
68 μ
Center of Cavity
and of FPA
Center of
Offset Between Center of
Silicium
Silicium and Center of
Cavity:
A
X: 0
Y: 68 ^μm
Die Cavity:
0.508+0.051
Bonding Cavity:
0.508+0.051
A-
Section A
Die:
0.508+0.01
Glass Window:
1.0+/-0.05
Drawing Not to Scale
Figure 14. Die Alignment
http://onsemi.com
21
Window Adhesive:
0.08+0.02
Die Adhesive:
0.08+0.02