SA3291_16 Datasheet, PDF (20/21 Pages) ON Semiconductor – Preconfigured Wireless DSP System

AYRE SA3291
PACKAGE DIMENSIONS
SIP32 6.35x3.68
CASE 127DW
ISSUE O
D
A
B
ÈÈÈÈÈÈ ^{PIN 1}
INDICATOR
0.13 C
0.13 C
TOP VIEW
0.13 C
0.05 C
NOTE 3
SIDE VIEW
e1
12
E
A2 A
A1
6X b1
L2
20
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BUMPS.
4. DIMENSIONS b, b1, L AND L2 ARE MEASURED
AT THE MAXIMUM BUMP DIMENSION PARALLEL
TO DATUM C. THE POSITIONAL TOLERANCE
APPLIES TO ALL OF THE SOLDER BUMPS.
MILLIMETERS
DIM MIN MAX
A
−−− 1.960
A1 0.076 0.180
A2 −−− 1.780
b 0.478 0.538
b1 0.275 0.335
D
6.350 BSC
D2 0.203 BSC
D3 1.067 BSC
E
3.683 BSC
e
0.914 BSC
e1
0.696 BSC
e2
0.699 BSC
L 0.580 0.640
L2 1.177 1.237
e
e/2
6X b1
26X L
0.05 C A B
0.03 C NOTE 4
RECOMMENDED
9
1
SOLDERING FOOTPRINT*
e2
25X b
D2
D3
BOTTOM VIEW
0.05 C A B
0.03 C NOTE 4
PACKAGE
OUTLINE
0.699
PITCH
0.203
1.067
6X
0.370
1
6X
0.370
0.914
PITCH
26X
0.650
25X
0.540
0.696
PITCH
1.239
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
20