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STD5407N Datasheet, PDF (2/6 Pages) ON Semiconductor – 40 V, 38 A, Single N-Channel, DPAK
NTD5407N, STD5407N
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise stated)
Parameter
Symbol
Test Condition
Min
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage V(BR)DSS
VGS = 0 V, ID = 250 mA
40
Drain−to−Source Breakdown Voltage V(BR)DSS/TJ
Temperature Coefficient
Zero Gate Voltage Drain Current
Gate−to−Source Leakage Current
ON CHARACTERISTICS (Note 2)
IDSS
IGSS
VGS = 0 V,
VDS = 40 V
TJ = 25°C
TJ = 100°C
VDS = 0 V, VGS = ±30 V
Gate Threshold Voltage
Gate Threshold Temperature
Coefficient
VGS(TH)
VGS = VDS, ID = 250 mA
1.5
VGS(TH)/TJ
Drain−to−Source On Resistance
Forward Transconductance
CHARGES AND CAPACITANCES
RDS(on)
gFS
VGS = 10 V, ID = 20 A
VGS = 5.0 V, ID = 10 A
VGS = 10 V, ID = 18 A
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
CISS
COSS
CRSS
VGS = 0 V, f = 1.0 MHz,
VDS = 32 V
Total Gate Charge
Gate−to−Source Charge
Gate−to−Drain Charge
QG(TOT)
QGS
QGD
VGS = 10 V, VDS = 32 V,
ID = 38 A
SWITCHING CHARACTERISTICS, VGS = 10 V (Note 3)
Turn−On Delay Time
td(ON)
Rise Time
Turn−Off Delay Time
tr
td(OFF)
VGS = 10 V, VDD = 32 V,
ID = 38 A, RG = 2.5 W
Fall Time
tf
SWITCHING CHARACTERISTICS, VGS = 5 V (Note 3)
Turn−On Delay Time
td(ON)
Rise Time
Turn−Off Delay Time
tr
td(OFF)
VGS = 5 V, VDD = 20 V,
ID = 20 A, RG = 2.5 W
Fall Time
tf
DRAIN−SOURCE DIODE CHARACTERISTICS (Note 2)
Forward Diode Voltage
VSD
VGS = 0 V,
TJ = 25°C
IS = 5.0 A
TJ = 125°C
Reverse Recovery Time
tRR
Charge Time
Discharge Time
ta
VGS = 0 V, dIS/dt = 100 A/ms,
tb
IS = 15 A
Reverse Recovery Charge
QRR
2. Pulse Test: pulse width ≤ 300 ms, duty cycle ≤ 2%.
3. Switching characteristics are independent of operating junction temperatures.
Typ
Max
Unit
V
39
mV/°C
1.0
mA
10
±100
nA
3.5
V
−6.0
mV/°C
21
26
mW
32
40
15
S
615
1000
pF
173
80
20
nC
2.25
10.5
6.8
ns
17
66
51
10
ns
175
13
23
0.9
1.1
V
0.75
38
ns
20.5
17
40
nC
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