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NSS40301MZ4T1G Datasheet, PDF (2/6 Pages) ON Semiconductor – Bipolar Power Transistors 40 V, 3.0 A, Low VCE(sat)
NSS40301MZ4
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Case
Junction−to−Ambient on 1” sq. (645 sq. mm) Collector pad on FR−4 bd material
Junction−to−Ambient on 0.012” sq. (7.6 sq. mm) Collector pad on FR−4 bd material
Maximum Lead Temperature for Soldering Purposes, 1/8” from case for 5 seconds
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)
Characteristic
Symbol
Min
OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage (IC = 10 mAdc, IB = 0 Adc)
Emitter−Base Voltage (IE = 50 mAdc, IC = 0 Adc)
Collector Cutoff Current (VCB = 40 Vdc)
Emitter Cutoff Current (VBE = 6.0 Vdc)
ON CHARACTERISTICS (Note 3)
VCEO(sus)
40
VEBO
6.0
ICBO
−
IEBO
−
Collector−Emitter Saturation Voltage
(IC = 0.5 Adc, IB = 50 mAdc)
(IC = 1.0 Adc, IB = 20 mAdc)
(IC = 3.0 Adc, IB = 0.3 Adc)
Base−Emitter Saturation Voltage (IC = 1.0 Adc, IB = 0.1 Adc)
Base−Emitter On Voltage (IC = 1.0 Adc, VCE = 2.0 Vdc)
DC Current Gain
(IC = 0.5 Adc, VCE = 1.0 Vdc)
(IC = 1.0 Adc, VCE = 1.0 Vdc)
(IC = 3.0 Adc, VCE = 1.0 Vdc)
DYNAMIC CHARACTERISTICS
VCE(sat)
−
−
−
VBE(sat)
−
VBE(on)
−
hFE
220
200
100
Output Capacitance (VCB = 10 Vdc, f = 1.0 MHz)
Input Capacitance (VEB = 5.0 Vdc, f = 1.0 MHz)
Current−Gain − Bandwidth Product (Note 4)
(IC = 500 mA, VCE = 10 V, Ftest = 1.0 MHz)
3. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%.
4. fT = |hFE| • ftest
Cob
−
Cib
−
fT
−
Symbol
RqJA
RqJA
TL
Max
64
155
260
Typ
Max
−
−
−
−
−
100
−
100
−
0.050
−
0.100
−
0.200
−
1.0
−
0.9
−
−
500
−
25
−
170
−
215
−
2.5
2.0
1.5
1.0
0.5
0
25
TC
TA
50
75
100
125
150
TJ, TEMPERATURE (°C)
Figure 1. Power Derating
Unit
°C/W
°C
Unit
Vdc
Vdc
nAdc
nAdc
Vdc
Vdc
Vdc
−
pF
pF
MHz
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