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MC74VHC1GT02_15 Datasheet, PDF (2/6 Pages) ON Semiconductor – Single 2-Input NOR Gate/ CMOS Logic Level Shifter
MC74VHC1GT02
MAXIMUM RATINGS
Symbol
VCC
VIN
VOUT
IIK
IOK
IOUT
ICC
TSTG
TL
TJ
qJA
DC Supply Voltage
DC Input Voltage
DC Output Voltage
Characteristics
VCC = 0
High or Low State
Input Diode Current
Output Diode Current
DC Output Current, per Pin
VOUT < GND; VOUT > VCC
DC Supply Current, VCC and GND
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature Under Bias
Thermal Resistance
SC70−5/SC−88A/SOT−353 (Note 1)
SOT23−5/TSOP−5/SC59−5
Value
−0.5 to +7.0
−0.5 to +7.0
−0.5 to 7.0
−0.5 to VCC + 0.5
−20
+20
+25
+50
*65 to )150
260
)150
350
230
Unit
V
V
V
mA
mA
mA
mA
_C
_C
_C
_C/W
PD
Power Dissipation in Still Air at 85_C
SC70−5/SC−88A/SOT−353
150
mW
SOT23−5/TSOP−5/SC59−5
200
MSL Moisture Sensitivity
Level 1
FR
VESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
u2000
V
Machine Model (Note 3)
u200
Charged Device Model (Note 4)
N/A
ILATCHUP Latchup Performance
Above VCC and Below GND at 125_C (Note 5)
$500
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
VCC
VIN
VOUT
DC Supply Voltage
DC Input Voltage
DC Output Voltage
TA
Operating Temperature Range
tr , tf Input Rise and Fall Time
3.0
0.0
VCC = 0
0.0
High or Low State
0.0
−55
VCC = 3.3 V ± 0.3 V
0
VCC = 5.0 V ± 0.5 V
0
5.5
5.5
5.5
VCC
+125
100
20
V
V
V
°C
ns/V
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
Time, Hours
Time, Years
80
1,032,200
117.8
90
419,300
47.9
100
178,700
20.4
110
79,600
9.4
120
37,000
4.2
130
17,800
2.0
140
8,900
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 3. Failure Rate vs. Time Junction Temperature
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2