MC74HC574A_14 Datasheet, PDF (2/9 Pages) ON Semiconductor – Octal 3-State Noninverting D Flip-Flop

MC74HC574A
Design Criteria
Internal Gate Count*
Value
66.5
Units
ea.
Internal Gate Propagation Delay
1.5
ns
Internal Gate Power Dissipation
5.0
mW
Speed Power Product
0.0075 pJ
*Equivalent to a two−input NAND gate.
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V_CC
V_I
V_O
I_IK
I_OK
I_O
I_CC
I_GND
T_STG
T_L
T_J
q_JA
DC Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Diode Current
DC Output Diode Current
DC Output Sink Current
DC Supply Current per Supply Pin
DC Ground Current per Ground Pin
Storage Temperature Range
Lead Temperature, 1 mm from Case for 10 Seconds
Junction Temperature under Bias
Thermal Resistance
(Note 1)
SOIC
TSSOP
−0.5 to +7.0
−0.5 to V_CC + 0.5
−0.5 to V_CC + 0.5
±20
±35
±35
±75
±75
−65 to +150
260
+150
96
128
V
V
V
mA
mA
mA
mA
mA
_C
_C
_C
_C/W
P_D
Power Dissipation in Still Air at 85_C
SOIC
500
mW
TSSOP
450
MSL Moisture Sensitivity
Level 1
F_R
V_ESD
Flammability Rating
ESD Withstand Voltage
Oxygen Index: 30% − 35% UL 94 V−0 @ 0.125 in
Human Body Model (Note 2)
> 4000
V
Machine Model (Note 3)
> 300
Charged Device Model (Note 4)
> 1000
I_Latchup Latchup Performance
Above V_CC and Below GND at 85_C (Note 5)
±300
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. I_O absolute maximum rating must be observed.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
V_CC
DC Supply Voltage
(Referenced to GND)
2.0
6.0
V
V_I, V_O DC Input Voltage, Output Voltage
(Referenced to GND)
0
V_CC
V
T_A
Operating Temperature, All Package Types
−55
+125
_C
t_r, t_f
Input Rise and Fall Time (Figure 2)
V_CC = 2.0 V
0
V_CC = 4.5 V
0
V_CC = 6.0 V
0
1000
ns
500
400
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
6. Unused inputs may not be left open. All inputs must be tied to a high− or low−logic input voltage level.
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