CS1087 Datasheet, PDF (2/12 Pages) ON Semiconductor – Vacuum Fluorescent Display Tube Driver

CS1087
MAXIMUM RATINGS*
Supply Voltage (V_BB)
Input Voltages (D_IN, CLK, STB, GREN)
Junction Temperature Range
Storage Temperature Range
ESD Susceptibility (Human Body Model)
ESD Susceptibility (Machine Model)
Package Thermal Resistance, DIP–40
Junction–to–Case, R_θJC
Junction–to–Ambient, R_θJA
Package Thermal Resistance, PLCC–44
Junction–to–Case, R_θJC
Junction–to–Ambient, R_θJA
Package Thermal Resistance, SO–28L
Junction–to–Case, R_θJC
Junction–to–Ambient, R_θJA
Lead Temperature Soldering:
Parameter
1. 10 second maximum.
2. 60 second maximum above 183°C.
*The maximum package power dissipation must be observed.
Value
–0.6 to +18
–0.6 to +6.0
–40 to +150
–55 to +150
2.0
200
20
45
16
55
Wave Solder (through hole styles only) Note 1
Reflow (SMD styles only) Note 2
15
75
260 Peak
230 Peak
Unit
V
V
°C
°C
kV
V
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
ELECTRICAL CHARACTERISTICS (8.0 V ≤ V_BB ≤ 16.5 V, Gnd = 0 V, –40°C ≤ T_J ≤ 105°C; unless otherwise stated. Note 3.)
Parameter
Test Conditions
Min
Typ
Max
Unit
V_BB Input
V_BB Input Voltage
I_BB0 Current
Reset Mode
–
No outputs active, V_BB = 16.5 V
All outputs forced low.
8.0
–
16.5
V
–
2.0
5.0
mA
–
6.5
7.5
V
D_IN, CLK, STB Inputs
V_IL1, Input Low Voltage
V_IH, Input High Voltage
I_IL, Input Current
GREN Input
–
–
V_IN = V_IH
–
–
1.6
V
3.3
–
–
V
–
7.5
20.0
µA
V_IL, Input Low Voltage
V_IH, Input High Voltage
I_IH, Input Pull–down Current
GRID1, GRID2, GRID3 Outputs
–
–
V_IN = 3.325 V
–
–
1.6
V
3.3
–
–
V
–
30
60
µA
I_OL
Sink Current
1.0
–
–
mA
I_OH
Source Current
50
–
–
mA
V_OL
I_OUT = 1.0 mA
–
–
0.5
V
V_OH
I_OUT = –50 mA, V_BB = 12 V
V_BB – 0.75
–
V_BB
V
3. Designed to meet these characteristics over the stated voltage and temperature ranges, though may not be 100% parametrically tested
in production.
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