AND8391-D Datasheet, PDF (2/8 Pages) ON Semiconductor – Thermal Considerations for the ON Semiconductor

AND8391/D
800
700 ^{500 mm2 2 oz}
500 mm² 1 oz
600
300 mm² 2 oz
500
300 mm² 1 oz
400
100 mm² 2 oz
300
200
100 mm² 1 oz
100
−40 −20
0
20
40
60
80
T_A, AMBIENT TEMPERATURE (°C)
Figure 1. Power Dissipation vs. Ambient
Temperature (SOD−123) @ T_J = 1505C for Variable
Copper Heat Spreader
P_D max @ 855C
500 mm² 2 oz Cu
500 mm² 1 oz Cu
300 mm² 2 oz Cu
300 mm² 1 oz Cu
100 mm² 2 oz Cu
100 mm² 1 oz Cu
1200
1000
800
600
400
0.6
T_A = 25°C
0.5
Power Curve 2.0 oz Cu
0.4
Power Curve 1.0 oz Cu
0.3
q_JA 1.0 oz Cu
0.2
200
q_JA 2.0 oz Cu
0.1
0
0
0
100 200 300 400 500 600 700
PCB COPPER AREA (mm²)
Figure 2. SOD−123 NSI14030T1G q_JA and P_D vs. Cu Area
241 mW
228 mW
189 mW
182 mW
117 mW
108 mW
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