AMIS-4168X Datasheet, PDF (19/20 Pages) AMI SEMICONDUCTOR – Fault Tolerant CAN Transceiver

AMIS-4168x
10.4 Manual Soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat
part of the lead. Contact time must be limited to ten seconds at up to 300°C.
When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320°C.
Table 11: Soldering Process
Package
Soldering Method
Wave
Re-flow⁽¹⁾
BGA, SQFP
Not suitable
Suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS
Not suitable ⁽²⁾
Suitable
PLCC ⁽³⁾ , SO, SOJ
Suitable
Suitable
LQFP, QFP, TQFP
Not recommended ⁽³⁾⁽⁴⁾
Suitable
SSOP, TSSOP, VSO
Not recommended ⁽⁵⁾
Suitable
Notes:
(1)
(2)
(3)
(4)
(5)
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size
of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For
details, refer to the drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.”
These packages are not suitable for wave soldering because a solder joint between the PCB and heatsink (at bottom version) can not be achieved, and because
solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder
thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.65mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.5mm.
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