CAV25M01_15 Datasheet, PDF (13/14 Pages) ON Semiconductor – 1 Mb SPI Serial CMOS EEPROM

CAV25M01
PACKAGE DIMENSIONS
WLCSP8, 1.95x2.24
CASE 567MP
ISSUE O
PIN A1
ÈÈÈÈ _REFERENCE
E
2X
0.10 C
2X
0.10 C
0.10 C
TOP VIEW
DETAIL A
AB
D
A2
A
BACKSIDE
COATING
DETAIL A
A3
A2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
4. DATUM C, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER PARALLEL TO DATUM C.
MILLIMETERS
DIM MIN MAX
A
−−− 0.39
A1 0.08 0.12
A2
0.23 REF
A3 0.025 REF
b 0.16 0.20
D
1.95 BSC
E
2.24 BSC
e
0.80 BSC
e1
0.693 BSC
0.08 C
NOTE 3
A1
SIDE VIEW
C
SEATING
PLANE
NOTE 4
e/2
C
e
e1
RECOMMENDED
SOLDERING FOOTPRINT*
0.40
PITCH
A1
0.800
PITCH
0.693
PITCH
B
A
12 3 45
BOTTOM VIEW
8X b
0.05 C A B
0.03 C NOTE 5
PACKAGE
OUTLINE
8X
0.18
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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