MT9F002 Datasheet, PDF (11/93 Pages) ON Semiconductor – CMOS Digital Image Sensor

MT9F002: 1/2.3-Inch 14 Mp CMOS Digital Image Sensor
Operating Modes
Figure 6:
6. The parallel interface output pads can be left unconnected when the serial output interface is used.
7. ON Semiconductor recommends that 0.1F and 10F decoupling capacitors for each power supply
are mounted as close as possible to the pad. Actual values and results may vary depending on lay-
out and design considerations. Check the MT9F002 demo headboard schematics for circuit recom-
mendations.
8. TEST signals must be tied to DGND for normal sensor operation.
9. ON Semiconductor recommends that analog power planes are placed in a manner such that cou-
pling with the digital power planes is minimized.
10. For serial HiSPi HiVCM mode, set register bit R0x306E[9] = 1 and VDD_TX = VDD_IO = 1.8V.
Typical Configuration: Parallel Pixel Data Interface
Digital Digital
I/O core
power¹ power¹
PLL Analog Analog
power¹ power¹ power¹
VDD_IO VDD
VDD_PLL VAA VAA_PIX
Master clock
(2–64 MHz)
From
Controller
EXTCLK
SDATA
SCLK
RESET_BAR
GPI[3:0]⁴
TEST
DGND
VDD_IO
VDD
VDD_PLL
VAA
VAA_PIX
1.0µF 0.1µF 1.0µF 0.1µF 1.0µF 0.1µF 1.0µF 0.1µF 1.0µF 0.1µF
Digital
ground
DOUT [11:0]
PIXCLK
LINE_VALID
FRAME_VALID
SHUTTER
FLASH
AGND
To
controller
parallel port
Analog
ground
Notes:
1. All power supplies should be adequately decoupled. ON Semiconductor recommends having 1.0F
and 0.1F decoupling capacitors for every power supply.
2. ON Semiconductor recommends a resistor value of 1.5k, but a greater value may be used for
slower two-wire speed.
3. This pull-up resistor is not required if the controller drives a valid logic level on SCLK at all times.
4. The GPI pins can be statically pulled HIGH or LOW and can be programmed to perform special func-
tions (TRIGGER/VD, OE_BAR, SADDR, STANDBY) to be dynamically controlled. GPI pads can be left
floating, when not used.
5. VPP, which is not shown in Figure 6, is left unconnected during normal operation.
6. The serial interface output pads can be left unconnected when the parallel output interface is used.
7. ON Semiconductor recommends that 0.1F and 10F decoupling capacitors for each power supply
are mounted as close as possible to the pad. Actual values and results may vary depending on lay-
out and design considerations. Check the MT9F002 demo headboard schematics for circuit recom-
mendations.
8. TEST signals must be tied to DGND for normal sensor operation.
MT9F002 DS Rev. H Pub. 6/15 EN
11
©Semiconductor Components Industries, LLC,2015.