N24C64 Datasheet, PDF (10/11 Pages) ON Semiconductor – 64 Kb I2C CMOS Serial EEPROM

N24C64
PACKAGE DIMENSIONS
WLCSP4 0.77x0.77, 0.35P
CASE 567NH
ISSUE A
PIN A1
REFERENCE
E
AB
ÈÈÈÈ _D
TOP VIEW
DETAIL A
0.05 C
A
0.05 C
NOTE 4
A1 _{SIDE VIEW}
NOTE 3
C
SEATING
PLANE
0.05
0.03
NOTE 5
4X b
C AB
C
e
e
B
A
12
BOTTOM VIEW
BACKSIDE
COATING
NOTE 6
A3
A2
DETAIL A
OPTIONAL CONSTRUCTION
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE
SPHERICAL CROWNS OF THE CONTACT BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS OF
CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM CON-
TACT BALL DIAMETER PARALLEL TO DATUM C.
6. BACKSIDE COATING IS OPTIONAL.
MILLIMETERS
DIM MIN NOM MAX
A
−−−
−−− 0.38
A1 0.08 0.10 0.12
A2
0.23 REF
A3
0.025 REF
b 0.16 0.18 0.20
D 0.75 0.77 0.79
E 0.75 0.77 0.79
e
0.35 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
0.35
PITCH
4X
0.18
0.35
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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