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N02L63W2A Datasheet, PDF (10/11 Pages) ON Semiconductor – 2Mb Ultra-Low Power Asynchronous CMOS SRAM 128K × 16 bit
N02L63W2A
Ball Grid Array Package
D
A1 BALL PAD
CORNER (3)
0.28±0.05
1.24±0.10
E
1. 0.35±0.05 DIA.
K TYP
TOP VIEW
SIDE VIEW
2. SEATING PLANE - Z
0.15 Z
0.05 Z
SD
A1 BALL PAD
1. DIMENSION IS MEASURED AT THE
MAXIMUM SOLDER BALL DIAMETER.
CORNER
PARALLEL TO PRIMARY Z.
2. PRIMARY DATUM Z AND SEATING
PLANE ARE DEFINED BY THE
e
SPHERICAL CROWNS OF THE
SOLDER BALLS.
SE
3. A1 BALL PAD CORNER I.D. TO BE
MARKED BY INK.
J TYP
e
BOTTOM VIEW
Dimensions (mm)
D
E
6±0.10 8±0.10
SD
0.375
e = 0.75
SE
0.375
J
1.125
K
1.375
BALL
MATRIX
TYPE
FULL
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