English
Language : 

ULPMC10 Datasheet, PDF (1/19 Pages) ON Semiconductor – Struix System-in-Package
ULPMC10
Microcontroller for Struix
System-in-Package (SiP)
Introduction
ULPMC10 is an industry−leading 32−bit microprocessor built
around an ARM® Cortex®−M3 core that is designed for capturing and
processing biometric signals within medical devices. ULPMC10 is
ideally suited to be integrated with custom designed proprietary
application specific integrated circuit (ASICs) within the Struix
System−in−Package (SiP) solution from ON Semiconductor. This
complete energy efficient solution enables manufacturers to develop
miniature, high performance, low power, precision−sensing medical
applications.
ULPMC10 delivers outstanding computational performance and
exceptional system response to events, while meeting the challenges
of low dynamic and static power constraints. The processor is highly
configurable, enabling a wide range of medical implementations from
those requiring low duty−cycle operations to size−sensitive devices
requiring a minimal semiconductor footprint.
ULPMC10 features built−in, advanced power management
including system monitoring for fail−safe operation. This allows for a
wide variety of battery voltages for efficiently powering the device
without the need for external, active components. It encompasses a
combination of charge pump based power conversion and regulation
providing an optimal balance between power and execution speed.
A comprehensive and easy−to−use suite of development tools is
available from IAR Systems including CMSIS based software
interfaces.
www.onsemi.com
1 48
QFN48 6x6
CASE 485AN
MARKING DIAGRAM
XXXXXXXX
AWLYYWWG
XXX = Specific Device Code
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G = Pb−Free Package
Key Features
Powerful and Efficient Processing Architecture
• 32−bit ARM Cortex−M3 Processor
• 512 kB On−chip Flash for Program and User Data
Storage
• 24 kB On−chip SRAM Memory
• Flexible DMA, 2 General−purpose Timers, CRC
Calculator
• No External Voltage Required for Flash Write
Operation
Ultra Low−Power and Smart Power Management
• Less than 200 mA / MHz, up to 5 MHz Clock Speed
• Less than 400 mA / MHz, between 5 MHz and 40 MHz
Clock Speed
• Flexible Input Voltage Range between 1.3 V; 3.6 V (3
V Nominal Supply Voltage)
• Ultra−low−current Sleep Mode with Real−time Clock
Active (< 200 nA)
• On−chip Charge Pump for Effective Power Conversion
and Powering of External, Devices such as Wireless
Bluetooth® Low−energy
• Low−current Standby Mode with Real−time Clock
Active, Register, and SRAM Retention (< 500 nA)
• Integrated Power Supplies Minimize Need for External
Components, Only a Minimum of External Passives is
Required
Clock Management
• Built−in RTC with External Crystal
• On−chip RC Oscillator for Internal Clock Generation
up to 40 MHz
• Integrated PLL (up to 20 MHz Output Signal) – Allow
for RTC Crystal only Operation (no Additional Crystal
Required)
• Divider Structure to Efficiently Clock any Portion of
the Device
Analog−to−Digital Conversion
• Single 12−bit ADC with 3 Multiplexed Inputs
• On−the−fly Data Rate Configurability
Temperature Sensor
• Built−in, Junction−based Temperature Sensor Covering
0°C up to 50°C
© Semiconductor Components Industries, LLC, 2015
1
July, 2015 − Rev. 4
Publication Order Number:
ULPMC10/D