SMF05 Datasheet, PDF (1/5 Pages) Semtech Corporation – TVS Diode Array For ESD and Latch-Up Protection

SMF05T1
Quad Array for ESD
Protection
ESD Protection Diodes with Low
Clamping Voltage
This quad monolithic silicon voltage suppressor is designed for
applications requiring transient overvoltage protection capability. It is
intended for use in voltage and ESD sensitive equipment such as
computers, printers, business machines, communication systems,
medical equipment, and other applications. Its quad junction common
anode design protects four separate lines using only one package.
These devices are ideal for situations where board space is at a
premium.
Specification Features
• Low Clamping Voltage
• Stand Off Voltage 5 V
• Low Leakage < 5 mA @ 5 V
• SC−88A Package Allows Four Separate Unidirectional
Configurations
• IEC6100−4−2 Level 4 ESD Protection
• Pb−Free Packages are Available*
Mechanical Characteristics
• Void Free, Transfer−Molded, Thermosetting Plastic Case
• Corrosion Resistant Finish, Easily Solderable
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
MAXIMUM RATINGS (T_A = 25°C unless otherwise noted)
http://onsemi.com
SC−88A/SOT−323
CASE 419A
STYLE 5
MARKING
DIAGRAM
4
5
60 MG
G
1 23
60
= Device Marking
M
= One Digit Date Code
G = Pb−Free Package
(Note: Microdot may be in either location)
1
Cathode
2
Anode
3
Cathode
5
Cathode
4
Cathode
Characteristic
Symbol
Value
Unit
Peak Power Dissipation @ 8 X 20 ms
@T_A ≤ 25°C
Steady State Power − 1 Diode
(Note 1)
Thermal Resistance
Junction−to−Ambient
Above 25°C, Derate
P_pk
P_D
R_qJA
200
W
385
mW
325
°C/W
3.1
mW/°C
ORDERING INFORMATION
Device
Package
Shipping^†
SMF05T1
SC−88A 3000/Tape & Reel
SMF05T1G
SC−88A 3000/Tape & Reel
(Pb−Free)
Maximum Junction Temperature
Operating Junction and Storage
Temperature Range
T_Jmax
150
°C
T_J T_stg −55 to +150
°C
ESD Discharge
IEC61000−4−2, Air Discharge
IEC61000−4−2, Contact Discharge
30
kV
30
SMF05T2G
SC−88A 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Lead Solder Temperature
(10 seconds duration)
T_L
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Only 1 diode under power. For all 4 diodes under power, P_D will be 25%.
Mounted on FR−4 board with min pad.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2009
1
August, 2009 − Rev. 4
Publication Order Number:
SMF05T1/D