SBAW56WT1G Datasheet, PDF(1/4 Page) ON Semiconductor – Dual Switching Diode, Common Anode

English

English German Russian Spanish Italian Polish Chinese Japanese Korean French Portuguese	Language :

SBAW56WT1G Datasheet, PDF (1/4 Pages) ON Semiconductor – Dual Switching Diode, Common Anode

BAW56WT1G,

SBAW56WT1G

Dual Switching Diode,

Common Anode

Features

ï· AECâQ101 Qualified and PPAP Capable

ï· S Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements

ï· These Devices are PbâFree, Halogen Free/BFR Free and are RoHS

Compliant*

MAXIMUM RATINGS (TA = 25ï°C)

Rating

Symbol Max Unit

Reverse Voltage

Forward Current

200

Peak Forward Surge Current

IFM(surge) 500

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

THERMAL CHARACTERISTICS (TA = 25ï°C)

Characteristic

Symbol Max Unit

Total Device Dissipation FRâ 5 Board

(Note 1)

TA = 25ï°C

Derate above 25ï°C

200

1.6 mW/ï°C

Thermal Resistance, JunctionâtoâAmbient

Total Device Dissipation

Alumina Substrate (Note 2) TA = 25ï°C

Derate above 25ï°C

RqJA

625

ï°C/W

300

2.4 mW/ï°C

Thermal Resistance, JunctionâtoâAmbient

Junction and Storage Temperature

RqJA

TJ, Tstg

417

â55 to

+150

ï°C/W

ï°C

1. FRâ5 = 1.0 0.75 0.062 in.

2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina.

http://onsemi.com

SCâ70

CASE 419

STYLE 4

ANODE

CATHODE

MARKING DIAGRAM

A1 M G

A1 = Device Code

M = Date Code*

G = PbâFree Package

(Note: Microdot may be in either location)

*Date Code orientation may vary depending

upon manufacturing location.

ORDERING INFORMATION

Device

Package

Shippingâ

BAW56WT1G

SBAW56WT1G

SCâ70 3,000 / Tape & Reel

(PbâFree)

SCâ70 3,000 / Tape & Reel

(PbâFree)

â For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

*For additional information on our PbâFree strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

ï£ Semiconductor Components Industries, LLC, 2011

November, 2011 â Rev. 7

Publication Order Number:

BAW56WT1/D

▷