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SBAS40-06LT1G Datasheet, PDF (1/3 Pages) ON Semiconductor – Common Anode Schottky Common Anode Schottky
BAS40-06LT1G,
SBAS40-06LT1G
Common Anode Schottky
Barrier Diodes
These Schottky barrier diodes are designed for high speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand held and portable
applications where space is limited.
Features
 Extremely Fast Switching Speed
 Low Forward Voltage
 AEC Qualified and PPAP Capable
 S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
 These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating
Symbol Value
Unit
Reverse Voltage
VR
40
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Forward Power Dissipation
@ TA = 25C
Derate above 25C
Operating Junction and Storage
Temperature Range
Forward Continuous Current
Single Forward Current
tv1s
t v 10 ms
Thermal Resistance (Note 1)
Junction−to−Ambient (Note 2)
1. FR−4 @ minimum pad.
2. FR−4 @ 1.0 x 1.0 in pad.
Symbol
Max
Unit
PF
225
mW
1.8
mW/C
TJ, Tstg −55 to +150 C
IFM
IFSM
RqJA
120
mA
mA
200
600
508
C/W
311
http://onsemi.com
40 VOLTS
SCHOTTKY BARRIER DIODE
SOT−23 (TO−236)
CASE 318
STYLE 12
ANODE
3
CATHODE
1
2
CATHODE
MARKING DIAGRAM
L2 M G
G
L2 = Specific Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping†
BAS40−06LT1G
SOT−23
(Pb−Free)
3,000 /
Tape & Reel
SBAS40−06LT1G SOT−23
(Pb−Free)
3,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques Reference
Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2011
1
November, 2011 − Rev. 8
Publication Order Number:
BAS40−06LT1/D