RB520S30T1G Datasheet, PDF (1/3 Pages) ON Semiconductor – Schottky Barrier Diode

RB520S30T1G,
RB520S30T5G
Schottky Barrier Diode
These Schottky barrier diodes are designed for high−speed
switching applications, circuit protection, and voltage clamping.
Extremely low forward voltage reduces conduction loss. Miniature
surface mount package is excellent for hand−held and portable
applications where space is limited.
Features
• Extremely Fast Switching Speed
• Extremely Low Forward Voltage 0.6 V (max) @ I_F = 200 mA
• Low Reverse Current
• ESD Rating: Class 3B per Human Body Model
Class C per Machine Model
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating
Symbol Value
Unit
Reverse Voltage
V_R
30
Vdc
Forward Current DC
I_F
200
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation FR−5 Board,
(Note 1) T_A = 25°C
Derate above 25°C
P_D
200
mW
1.57 mW/°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
1. FR−5 Minimum Pad.
R_qJA
T_J, T_stg
635
−55 to +150
°C/W
°C
ELECTRICAL CHARACTERISTICS (T_A = 25°C unless otherwise noted)
Characteristic
Symbol Min Typ Max Unit
Reverse Leakage
(V_R = 10 V)
I_R
− − 1.0 mA
Forward Voltage
(I_F = 200 mA)
V_F
− − 0.60 Vdc
http://onsemi.com
30 VOLT SCHOTTKY
BARRIER DIODE
1
CATHODE
2
ANODE
2
1
SOD−523
CASE 502
MARKING DIAGRAM
5J M G
G
1
2
5J = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation position may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
RB520S30T1G SOD−523
4 mm Pitch
(Pb−Free) 3000/Tape & Reel
RB520S30T5G SOD−523
4 mm Pitch
(Pb−Free) 8000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
July, 2011 − Rev. 9
Publication Order Number:
RB520S30T1/D