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| PZT751T1G_10 Datasheet, PDF (1/4 Pages) ON Semiconductor – PNP Silicon Planar Epitaxial Transistor | |||
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PZT751T1G
PNP Silicon Planar
Epitaxial Transistor
This PNP Silicon Epitaxial transistor is designed for use in
industrial and consumer applications. The device is housed in the
SOT--223 package which is designed for medium power surface
mount applications.
Features
ï· High Current: 2.0 A
ï· The SOT--223 Package can be soldered using wave or reflow.
ï· SOT--223 package ensures level mounting, resulting in improved
thermal conduction, and allows visual inspection of soldered joints.
The formed leads absorb thermal stress during soldering, eliminating
the possibility of damage to the die
ï· NPN Complement is PZT651T1
ï· These Devices are Pb--Free, Halogen Free/BFR Free and are RoHS
Compliant
http://onsemi.com
SOT--223 PACKAGE
HIGH CURRENT
PNP SILICON TRANSISTOR
SURFACE MOUNT
COLLECTOR 2, 4
BASE
1
MAXIMUM RATINGS (TC = 25ï°C unless otherwise noted)
Rating
Symbol Value
Unit
Collector--Emitter Voltage
Collector--Base Voltage
Emitter--Base Voltage
Collector Current
Total Power Dissipation
@ TA = 25ï°C (Note 1)
Derate above 25ï°C
VCEO
VCBO
VEBO
IC
PD
60
Vdc
80
Vdc
5.0
Vdc
2.0
Adc
W
0.8
mW/ï°C
6.4
Storage Temperature Range
Junction Temperature
THERMAL CHARACTERISTICS
Tstg -- 65 to 150
ï°C
TJ
150
ï°C
Rating
Symbol Value
Unit
Thermal Resistance from Junction--to--
RθJA
156
ï°C/W
Ambient in Free Air
Maximum Temperature for Soldering
TL
260
ï°C
Purposes
Time in Solder Bath
10
Sec
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on a FR--4 glass epoxy printed circuit board using minimum
recommended footprint.
EMITTER 3
MARKING
DIAGRAM
SOT--223
CASE 318E
STYLE 1
1
AYW
ZT751G
G
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb--Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping
PZT751T1G
SOT--223 1000 / Tape & Reel
(Pb--Free)
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
ï£ Semiconductor Components Industries, LLC, 2010
1
October, 2010 -- Rev. 6
Publication Order Number:
PZT751T1/D
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