PZT651_16 Datasheet, PDF (1/4 Pages) ON Semiconductor – NPN Silicon Planar Epitaxial Transistor

PZT651
NPN Silicon Planar
Epitaxial Transistor
This NPN Silicon Epitaxial transistor is designed for use in
industrial and consumer applications. The device is housed in the
SOT−223 package which is designed for medium power surface
mount applications.
SOT−223 package ensures level mounting, resulting in improved
thermal conduction, and allows visual inspection of soldered joints.
The formed leads absorb thermal stress during soldering, eliminating
the possibility of damage to the die.
Features
• High Current
• The SOT−223 Package can be Soldered Using Wave or Reflow
• PNP Complement is PZT751T1G
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (T_C = 25°C unless otherwise noted)
Rating
Symbol Value
Unit
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
Collector Current
Total Power Dissipation
@ T_A = 25°C (Note 1)
Derate above 25°C
V_CEO
V_CBO
V_EBO
I_C
P_D
60
Vdc
80
Vdc
5.0
Vdc
2.0
Adc
W
0.8
6.4
mW/°C
Storage Temperature Range
Junction Temperature
THERMAL CHARACTERISTICS
T_stg − 65 to 150 °C
T_J
150
°C
Characteristic
Symbol
Max
Unit
Thermal Resistance from
Junction−to−Ambient in Free Air
R_qJA
156
°C/W
Maximum Temperature for Soldering
T_L
260
°C
Purposes
Time in Solder Bath
10
Sec
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Device mounted on a FR−4 glass epoxy printed circuit board using minimum
recommended footprint.
www.onsemi.com
SOT−223 PACKAGE HIGH CURRENT
NPN SILICON TRANSISTOR
SURFACE MOUNT
4
123
SOT−223
CASE 318E−04
STYLE 1
COLLECTOR 2, 4
BASE
1
EMITTER 3
MARKING DIAGRAM
AYW
651 G
G
1
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
PZT651T1G
SPZT651T1G
SOT−223
(Pb−Free)
SOT−223
(Pb−Free)
1,000 / Tape & Reel
1,000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2016
1
December, 2016 − Rev. 10
Publication Order Number:
PZT651T1/D