PZT2907AT1_11 Datasheet, PDF (1/4 Pages) ON Semiconductor – PNP Silicon Epitaxial Transistor

PZT2907AT1,
SPZT2907AT1G
Preferred Device
PNP Silicon
Epitaxial Transistor
This PNP Silicon Epitaxial transistor is designed for use in linear
and switching applications. The device is housed in the SOT-223
package which is designed for medium power surface mount
applications.
Features
 NPN Complement is PZT2222AT1
 The SOT-223 package can be soldered using wave or reflow
 SOT-223 package ensures level mounting, resulting in improved
thermal conduction, and allows visual inspection of soldered joints.
The formed leads absorb thermal stress during soldering eliminating
the possibility of damage to the die.
 AEC−Q101 Qualified and PPAP Capable
 S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
 Pb−Free Packages are Available*
MAXIMUM RATINGS
Rating
Collector −Emitter Voltage
Collector −Base Voltage
Emitter −Base Voltage
Collector Current − Continuous
Symbol
V_CEO
V_CBO
V_EBO
I_C
Value
−60
−60
−5.0
−600
Unit
Vdc
Vdc
Vdc
mAdc
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation (Note 1)
T_A = 25C
Thermal Resistance Junction−to−Ambient
(Note 1)
Symbol
P_D
R_qJA
Max
1.5
12
83.3
Unit
W
mW/C
C/W
Lead Temperature for Soldering,
0.0625 from case
Time in Solder Bath
T_L
260
C
10
Sec
Operating and Storage Temperature Range T_J, T_stg −65 to
C
+150
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 with 1 oz and 713 mm² of copper area.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
http://onsemi.com
SOT−223
CASE 318E
STYLE 1
COLLECTOR
2, 4
1
BASE
3
EMITTER
MARKING DIAGRAM
AYW
P2F G
G
1
P2F = Specific Device Code
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
PZT2907AT1
SOT−223 1,000 / Tape & Reel
PZT2907AT1G SOT−223 1,000 / Tape & Reel
(Pb−Free)
SPZT2907AT1G
PZT2907AT3
SOT−223
(Pb−Free)
SOT−223
1,000 / Tape & Reel
4,000 / Tape & Reel
PZT2907AT3G SOT−223 4,000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
 Semiconductor Components Industries, LLC, 2011
1
November, 2011 − Rev. 9
Publication Order Number:
PZT2907AT1/D