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NVMFD5873NL_14 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET | |||
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NVMFD5873NL
Power MOSFET
60 V, 13 mW, 58 A, Dual NâChannel Logic
Level, Dual SOâ8FL
Features
⢠Small Footprint (5x6 mm) for Compact Designs
⢠Low RDS(on) to Minimize Conduction Losses
⢠Low Capacitance to Minimize Driver Losses
⢠NVMFD5873NLWF â Wettable Flanks Option for Enhanced Optical
Inspection
⢠AECâQ101 Qualified and PPAP Capable
⢠This is a PbâFree Device
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
DrainâtoâSource Voltage
VDSS
60
V
GateâtoâSource Voltage
VGS
"20 V
Continuous Drain Cur-
Tmb = 25°C
ID
rent RYJâmb (Notes 1,
2, 3, 4)
Steady Tmb = 100°C
Power Dissipation
State Tmb = 25°C
PD
RYJâmb (Notes 1, 2, 3)
Tmb = 100°C
58
A
41
107 W
54
Continuous Drain Cur-
TA = 25°C
ID
rent RqJA (Notes 1, 3
& 4)
Steady TA = 100°C
Power Dissipation
RqJA (Notes 1 & 3)
State
TA = 25°C
PD
TA = 100°C
10
A
7.0
3.1
W
1.6
Pulsed Drain Current TA = 25°C, tp = 10 ms
IDM
190
A
Operating Junction and Storage Temperature
TJ, Tstg â 55 to °C
175
Source Current (Body Diode)
IS
Single Pulse DrainâtoâSource Avalanche
EAS
Energy (TJ = 25°C, VGS = 10 V, IL(pk) = 28.3 A,
L = 0.1 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
TL
(1/8â³ from case for 10 s)
58
A
40
mJ
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)
Parameter
Symbol Value Unit
JunctionâtoâMounting Board (top) â Steady
State (Notes 2, 3)
RYJâmb
1.4
°C/W
JunctionâtoâAmbient â Steady State (Note 3)
RqJA
48
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Psi (Y) is used as required per JESD51â12 for packages in which
substantially less than 100% of the heat flows to single case surface.
3. Surfaceâmounted on FR4 board using a 650 mm2, 2 oz. Cu pad.
4. Maximum current for pulses as long as 1 second are higher but are dependent
on pulse duration and duty cycle.
http://onsemi.com
V(BR)DSS
60 V
RDS(on) MAX
13 mW @ 10 V
16.5 mW @ 4.5 V
ID MAX
58 A
Dual NâChannel
D1
D2
G1
G2
S1
S2
1
DFN8 5x6
(SO8FL)
CASE 506BT
MARKING DIAGRAM
D1 D1
S1
D1
G1 5873xx D1
S2 AYWZZ D2
G2
D2
D2 D2
5873NL = Specific Device Code
for NVMFD5873NL
5873LW = Specific Device Code
for NVMFD5873NLWF
A
= Assembly Location
Y
= Year
W
= Work Week
ZZ
= Lot Traceability
ORDERING INFORMATION
Device
Package Shippingâ
NVMFD5873NLT1G
DFN8 1500 / Tape &
(PbâFree)
Reel
NVMFD5873NLWFT1G DFN8 1500 / Tape &
(PbâFree)
Reel
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
1
September, 2014 â Rev. 3
Publication Order Number:
NVMFD5873NL/D
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