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NTR1P02LT1_06 Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET -20 V, -1.3 A, P-Channel SOT-23 Package
NTR1P02LT1
Power MOSFET
−20 V, −1.3 A, P−Channel
SOT−23 Package
These miniature surface mount MOSFETs low RDS(on) assure
minimal power loss and conserve energy, making these devices ideal
for use in space sensitive power management circuitry. Typical
applications are DC−DC converters and power management in
portable and battery−powered products such as computers, printers,
PCMCIA cards, cellular and cordless telephones.
Features
• Low RDS(on) Provides Higher Efficiency and Extends Battery Life
• Miniature SOT−23 Surface Mount Package Saves Board Space
• Pb−Free Packages are Available
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Drain Current
− Continuous @ TA = 25°C
− Pulsed Drain Current (tp ≤ 10 ms)
Total Power Dissipation @ TA = 25°C
Operating and Storage Temperature Range
VDSS
−20
V
VGS
±12
V
ID
IDM
PD
TJ, Tstg
−1.3
A
−4.0
A
400 mW
− 55 to °C
150
Thermal Resistance − Junction−to−Ambient
Maximum Lead Temperature for Soldering
Purposes, (1/8″ from case for 10 s)
RqJA
TL
300 °C/W
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
V(BR)DSS
−20 V
RDS(on) Max
220 mW
P−Channel
D
ID Max
−1.3 A
G
3
1
2
SOT−23
CASE 318
STYLE 21
S
MARKING DIAGRAM &
PIN ASSIGNMENT
Drain
3
P02 M G
G
1
Gate
2
Source
P02 = Specific Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package
NTR1P02LT1 SOT−23
NTR1P02LT1G SOT−23
(Pb−Free)
Shipping†
3000 Tape & Reel
3000 Tape & Reel
NTR1P02LT3 SOT−23 10,000 Tape & Reel
NTR1P02LT3G SOT−23 10,000 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
1
May, 2006 − Rev. 8
Publication Order Number:
NTR1P02LT1/D