NTNS3164NZ_13 Datasheet, PDF (1/6 Pages) ON Semiconductor – Small Signal MOSFET 20 V, 361 mA, Single N.Channel, SOT.883 (XDFN3) 1.0 x 0.6 x 0.4 mm Package

NTNS3164NZ
Small Signal MOSFET
20 V, 361 mA, Single N−Channel, SOT−883
(XDFN3) 1.0 x 0.6 x 0.4 mm Package
Features
• Single N−Channel MOSFET
• Ultra Low Profile SOT−883 (XDFN3) 1.0 x 0.6 x 0.4 mm for
Extremely Thin Environments Such as Portable Electronics
• Low R_DS(on) Solution in the Ultra Small 1.0 x 0.6 mm Package
• 1.5 V Gate Drive
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• High Side Switch
• High Speed Interfacing
• Level Shift and Translate
• Optimized for Power Management in Ultra Portable Solutions
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Steady
State
Power Dissipation
(Note 1)
t≤5s
Steady
State
T_A = 25°C
T_A = 85°C
T_A = 25°C
T_A = 25°C
V_DSS
V_GS
I_D
P_D
20
V
±8
V
361 mA
260
427
155 mW
t≤5s
217
Pulsed Drain
Current
t_p = 10 ms
I_DM
1082 mA
Operating Junction and Storage
Temperature
T_J, T_STG −55 to °C
150
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
I_S
129 mA
T_L
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using the minimum recommended pad size,
or 2 mm², 1 oz Cu.
2. Pulse Test: pulse width ≤ 300 ms, duty cycle ≤ 2%
http://onsemi.com
V_(BR)DSS
20 V
R_DS(on) MAX
0.7 W @ 4.5 V
1.0 W @ 2.5 V
2.0 W @ 1.8 V
4.0 W @ 1.5 V
I_D Max
361 mA
N−CHANNEL MOSFET
D (3)
G (1)
S (2)
3
MARKING DIAGRAM
21
64 M
SOT−883 (XDFN3)
CASE 506CB
64
= Specific Device Code
M
= Date Code
ORDERING INFORMATION
Device
Package
NTNS3164NZT5G SOT−883
(Pb−Free)
Shipping^†
8000 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
1
March, 2013 − Rev. 0
Publication Order Number:
NTNS3164NZ/D