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NTMFS4921N Datasheet, PDF (1/7 Pages) ON Semiconductor – Power MOSFET 30 V, 58.5 A, Single N−Channel, SO−8 FL | |||
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NTMFS4921N
Power MOSFET
30 V, 58.5 A, Single NâChannel, SOâ8 FL
Features
⢠Low RDS(on) to Minimize Conduction Losses
⢠Low Capacitance to Minimize Driver Losses
⢠Optimized Gate Charge to Minimize Switching Losses
⢠Thermally Enhanced SOâ8 Package
⢠These are PbâFree Device
Applications
⢠CPU Power Delivery
⢠DCâDC Converters
⢠High Side Switching
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
DrainâtoâSource Voltage
GateâtoâSource Voltage
Continuous Drain
Current RqJA
(Note 1)
VDSS
30
V
VGS
±20
V
TA = 25°C
ID
13.8
A
TA = 85°C
10
Power Dissipation
RqJA (Note 1)
TA = 25°C
PD
2.14
W
Continuous Drain
Current RqJA v
10 sec
TA = 25°C
ID
TA = 85°C
22.4
A
16.1
Power Dissipation
TA = 25°C
PD
RqJA, t v 10 sec
Steady
Continuous Drain
State TA = 25°C
ID
Current RqJA
(Note 2)
TA = 85°C
5.61
W
8.8
A
6.4
Power Dissipation
RqJA (Note 2)
TA = 25°C
PD
0.87
W
Continuous Drain
Current RqJC
(Note 1)
TC = 25°C
ID
TC = 85°C
58.5
A
42.3
Power Dissipation
RqJC (Note 1)
TC = 25°C
PD
Pulsed Drain
Current
tp=10ms TA = 25°C
IDM
38.5
W
117
A
Current limited by package
TA = 25°C
Operating Junction and Storage
Temperature
Source Current (Body Diode)
Drain to Source dV/dt
IDmaxpkg
TJ,
TSTG
IS
dV/dt
100
â55 to
+150
38.5
6
A
°C
A
V/ns
Single Pulse DrainâtoâSource Avalanche
Energy (VDD = 50 V, VGS = 10 V,
IL = 24 Apk, L = 0.3 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8â from case for 10 s)
EAS
TL
86
mJ
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
V(BR)DSS
30 V
RDS(ON) MAX
6.95 mW @ 10 V
10.8 mW @ 4.5 V
ID MAX
58.5 A
D (5,6)
G (4)
S (1,2,3)
NâCHANNEL MOSFET
1
SOâ8 FLAT LEAD
CASE 488AA
STYLE 1
MARKING
DIAGRAM
D
S
D
S 4921N
S AYWWG
G
G
D
D
A
= Assembly Location
Y
= Year
WW = Work Week
G
= PbâFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
NTMFS4921NT1G
Package
SOâ8FL
(PbâFree)
Shippingâ
1500 /
Tape & Reel
NTMFS4921NT3G SOâ8FL
(PbâFree)
5000 /
Tape & Reel
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our PbâFree strategy
and soldering details, please download the ON
Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2008
1
November, 2008 â Rev. 1
Publication Order Number:
NTMFS4921N/D
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