NTGS3136P_15 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET

NTGS3136P, NVGS3136P
Power MOSFET
−20 V, −5.8 A, Single P−Channel, TSOP−6
Features
• Low R_DS(on) in TSOP−6 Package
• 1.8 V Gate Rating
• Fast Switching
• NV Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Optimized for Battery and Load Management Applications in
Portable Equipment
• High Side Load Switch
• Switching Circuits for Game Consoles, Camera Phone, etc.
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
−20
V
Gate−to−Source Voltage
V_GS
$8.0
V
Continuous Drain
Current (Note 1)
Steady ^{TA = 25°C}
I_D
State _{TA = 85°C}
−5.1
−3.6
A
t v 5 s T_A = 25°C
−5.8
Power Dissipation
(Note 1)
Steady
P_D
State _{TA = 25°C}
tv5s
1.25
W
1.6
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
T_A = 25°C
I_D
Steady TA = 85°C
State
T_A = 25°C
P_D
−3.7
A
−2.7
0.7
W
Pulsed Drain Current t_p = 10 ms
I_DM
−20
A
Operating Junction and Storage Temperature
T_J,
−55 to °C
T_STG
150
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T_L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces)
2. Surface−mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.0775 in sq).
www.onsemi.com
V_(BR)DSS
−20 V
R_DS(ON) TYP
25 mW @ −4.5 V
32 mW @ −2.5 V
41 mW @ −1.8 V
I_D MAX
−5.1 A
−4.5 A
−2.5 A
P−Channel
1256
3
4
MARKING
DIAGRAM
TSOP−6
CASE 318G
1
STYLE 1
XXX MG
G
1
XXX
M
G
= Device Code
= Date Code
= Pb−Free Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
Drain Drain Source
6 54
1 23
Drain Drain Gate
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
1
February, 2015 − Rev. 2
Publication Order Number:
NTGS3136P/D