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NTD5802N_14 Datasheet, PDF (1/7 Pages) ON Semiconductor – Power MOSFET
NTD5802N, NVD5802N
Power MOSFET
40 V, Single N−Channel, 101 A DPAK
Features
• Low RDS(on) to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• MSL 1/260°C
• 100% Avalanche Tested
• NVD Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
Applications
• CPU Power Delivery
• DC−DC Converters
• Motor Driver
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
VDSS
40
V
Gate−to−Source Voltage
VGS
±20
V
Continuous Drain Cur-
rent (RqJC) (Note 1)
TC = 25°C
ID
TC = 85°C
101
A
78
Power Dissipation
(RqJC) (Note 1)
TC = 25°C
PD
Steady
Continuous Drain Cur- State TA = 25°C
ID
rent (RqJA) (Note 1)
TA = 85°C
93.75 W
16.4
A
12.7
Power Dissipation
(RqJA) (Note 1)
TA = 25°C
PD
2.5
W
Pulsed Drain Current tp=10ms TA = 25°C IDM
300
A
Current Limited by Package
TA = 25°C IDmaxPkg
45
A
Operating Junction and Storage Temperature TJ, Tstg −55 to °C
175
Source Current (Body Diode)
Drain to Source dV/dt
IS
dV/dt
50
A
6.0 V/ns
Single Pulse Drain−to−Source Avalanche En-
EAS
ergy (VDD = 32 V, VGS = 10 V,
L = 0.3 mH, IL(pk) = 40 A, RG = 25 W)
240 mJ
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
http://onsemi.com
V(BR)DSS
40 V
RDS(on)
4.4 mW @ 10 V
7.8 mW @ 5.0 V
D
ID
101 A
50 A
N−Channel
G
S
4
12
3
CASE 369C
DPAK
(Bent Lead)
STYLE 2
MARKING DIAGRAMS
& PIN ASSIGNMENT
4
Drain
2
1 Drain 3
Gate Source
A
= Assembly Location*
Y
= Year
WW = Work Week
5802N = Device Code
G
= Pb−Free Package
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly
code may be blank.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
August, 2014 − Rev. 7
Publication Order Number:
NTD5802N/D