NTD30N02G Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET 30 Amps, 24 Volts

NTD30N02
Power MOSFET
30 Amps, 24 Volts
N−Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
• Pb−Free Packages are Available
Typical Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Drain Current
− Continuous @ T_A = 25°C
− Single Pulse (t_pv10 ms)
Total Power Dissipation @ T_A = 25°C
Operating and Storage Temperature Range
V_DSS
V_GS
I_D
I_DM
P_D
T_J, T_stg
Single Pulse Drain−to−Source Avalanche
Energy − Starting T_J = 25°C
(V_DD = 24 Vdc, V_GS = 10 Vdc,
L = 1.0 mH, I_L(pk) = 10 A, R_G = 25 W)
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
E_AS
R_qJC
R_qJA
R_qJA
T_L
Value Unit
24 Vdc
"20 Vdc
Adc
30
100 Apk
75
W
−55 to °C
150
50 mJ
°C/W
1.65
67
120
260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. When surface mounted to an FR4 board using 1 in. pad size,
(Cu Area 1.127 sq in).
2. When surface mounted to an FR4 board using minimum recommended pad
size, (Cu Area 0.412 sq in).
http://onsemi.com
30 AMPERES
24 VOLTS
R_DS(on) = 11.2 mW (Typ.)
N−Channel
D
G
S
MARKING
DIAGRAM
4
4
Drain
12
3
DPAK
CASE 369C
STYLE 2
2
1 Drain 3
Gate
Source
D30N02 = Device Code
Y
= Year
WW = Work Week
G
= Pb−Free Device
ORDERING INFORMATION
Device
Package
Shipping^†
NTD30N02
NTD30N02G
NTD30N02T4
NTD30N02T4G
DPAK
75 Units/Rail
DPAK
(Pb−Free)
75 Units/Rail
DPAK 2500 Tape & Reel
DPAK 2500 Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
1
February, 2006 − Rev. 3
Publication Order Number:
NTD30N02/D