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NTD3055L170 Datasheet, PDF (1/8 Pages) ON Semiconductor – 9.0 Amps, 60 Volts, Logic Level, N−Channel DPAK
NTD3055L170
Power MOSFET
9.0 Amps, 60 Volts, Logic Level,
N−Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
• Pb−Free Packages are Available
Typical Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Drain−to−Gate Voltage (RGS = 10 MW)
Gate−to−Source Voltage
− Continuous
− Non−repetitive (tpv10 ms)
Drain Current
− Continuous @ TA = 25°C
− Continuous @ TA = 100°C
− Single Pulse (tpv10 ms)
Total Power Dissipation @ TA = 25°C
Derate above 25°C
Total Power Dissipation @ TA = 25°C (Note 1)
Total Power Dissipation @ TA = 25°C (Note 2)
Operating and Storage Temperature Range
VDSS
VDGR
VGS
VGS
ID
ID
IDM
PD
TJ, Tstg
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 5.0 Vdc,
L = 1.0 mH, IL(pk) = 7.75 A, VDS = 60 Vdc)
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
EAS
RqJC
RqJA
RqJA
TL
60
60
"15
"20
9.0
3.0
27
28.5
0.19
2.1
1.5
−55 to
175
30
Vdc
Vdc
Vdc
Adc
Apk
W
W/°C
W
W
°C
mJ
°C/W
5.2
71.4
100
260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. When surface mounted to an FR4 board using 0.5 sq in pad size.
2. When surface mounted to an FR4 board using minimum recommended
pad size.
http://onsemi.com
9.0 AMPERES, 60 VOLTS
RDS(on) = 170 mW
N−Channel
D
G
S
12
3
MARKING
DIAGRAMS
4
Drain
4
DPAK
CASE 369AA
(Surface Mounted)
STYLE 2
1
Gate
2
Drain
3
Source
4
1
2
3
DPAK−3
CASE 369D
(Straight Lead)
STYLE 2
4
Drain
12 3
Gate Drain Source
3170L
A
Y
W
= Device Code
= Assembly Location
= Year
= Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2004
1
August, 2004 − Rev. 3
Publication Order Number:
NTD3055L170/D