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NTD20P06L_16 Datasheet, PDF (1/7 Pages) ON Semiconductor – Power MOSFET | |||
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NTD20P06L, NTDV20P06L
Power MOSFET
â60 V, â15.5 A, Single PâChannel, DPAK
Features
⢠Withstands High Energy in Avalanche and Commutation Modes
⢠Low Gate Charge for Fast Switching
⢠AEC Q101 Qualified â NTDV20P06L
⢠These Devices are PbâFree and are RoHS Compliant
Applications
⢠Bridge Circuits
⢠Power Supplies, Power Motor Controls
⢠DCâDC Conversion
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
DrainâtoâSource Voltage
VDSS
â60
V
GateâtoâSource
Continuous
VGS
$20
V
Voltage
NonâRepetitive tp v10 ms VGSM $30
Continuous
Drain Current
(Note 1)
Steady State TA = 25°C
ID
â15.5 A
Power Dissipa- Steady State TA = 25°C
PD
tion (Note 1)
65
W
Pulsed Drain
Current
tp = 10 ms
IDM
$50
A
Operating Junction and Storage Temperature
Single Pulse DrainâtoâSource Avalanche
Energy (VDD = 25 V, VGS = 5 V, IPK = 15 A,
L = 2.7 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8â from case for 10 s)
TJ, â55 to °C
TSTG
175
EAS
304 mJ
TL
260 °C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
JunctionâtoâCase (Drain)
RqJC
2.3 °C/W
JunctionâtoâAmbient â Steady State (Note 1)
RqJA
80
JunctionâtoâAmbient â Steady State (Note 2)
RqJA
110
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surfaceâmounted on FR4 board using 1 in sq. pad size
(Cu area = 1.127 in sq. [1 oz] including traces)
2. Surfaceâmounted on FR4 board using the minimum recommended pad size
(Cu area = 0.412 in sq.)
www.onsemi.com
V(BR)DSS
â60 V
RDS(on) TYP
130 mW @ â5.0 V
ID MAX
(Note 1)
â15.5 A
PâChannel
D
G
4
12
3
DPAK
CASE 369C
STYLE 2
4
S
MARKING DIAGRAMS
4
Drain
1
Gate
2
Drain
3
Source
4
Drain
1
2
3
IPAK/DPAK
CASE 369D
STYLE 2
12 3
Gate Drain Source
20P06L
A
Y
WW
G
Device Code
= Assembly Location
= Year
= Work Week
= PbâFree Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
1
October, 2016 â Rev. 7
Publication Order Number:
NTD20P06L/D
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