NSVBAS21SLT1G Datasheet, PDF (1/3 Pages) ON Semiconductor – Dual Series High Voltage Switching Diode

BAS21SLT1G,
NSVBAS21SLT1G
Dual Series High Voltage
Switching Diode
Features
• Moisture Sensitivity Level: 1
• ESD Rating − Human Body Model: Class 1
ESD Rating − Machine Model: Class B
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
• NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
MAXIMUM RATINGS
Rating
Symbol Value
Unit
Continuous Reverse Voltage
V_R
250
Repetitive Peak Reverse Voltage
V_RRM
250
Peak Forward Current
I_F
225
Peak Forward Surge Current
I_FM(surge)
625
THERMAL CHARACTERISTICS
Vdc
Vdc
mAdc
mAdc
Characteristic
Symbol
Max
Unit
Total Device Dissipation FR− 5 Board
P_D
225
mW
(Note 1)
T_A = 25°C
Derate above 25°C
1.8
mW/°C
Thermal Resistance,
Junction to Ambient
R_qJA
556
°C/W
Total Device Dissipation
Alumina Substrate, (Note 2)
T_A = 25°C
Derate above 25°C
P_D
300
mW
2.4
mW/°C
Thermal Resistance,
Junction to Ambient
R_qJA
417
°C/W
Junction and Storage
Temperature Range
T_J, T_stg
−55 to
°C
+150
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0  0.75  0.062 in.
2. Alumina = 0.4  0.3  0.024 in. 99.5% alumina.
http://onsemi.com
ANODE
1
CATHODE
2
3
CATHODE/ANODE
3
1
2
SOT−23
CASE 318
STYLE 11
MARKING DIAGRAM
JT M G
G
1
JT = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
BAS21SLT1G
SOT−23 3000 / Tape & Reel
(Pb−Free)
NSVBAS21SLT1G SOT−23 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
1
January, 2013 − Rev. 6
Publication Order Number:
BAS21SLT1/D