NSTB60BDW1 Datasheet, PDF (1/5 Pages) ON Semiconductor – NPN Bias Resistor Transistor Combination

NSTB60BDW1
PNP General Purpose and
NPN Bias Resistor
Transistor Combination
• Simplifies Circuit Design
• Reduces Board Space
• Reduces Component Count
• Available in 8 mm, 7 inch/3000 Unit Tape and Reel
• ESD Rating − Human Body Model: Class 1B
ESD Rating − Machine Model: Class B
• NSV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
(T_A = 25°C unless otherwise noted, common for Q₁ and Q₂)
Rating
Symbol Q₁
Q₂
Unit
Collector-Emitter Voltage
V_CEO
− 50
50
Vdc
Collector-Base Voltage
V_CBO
− 50
50
Vdc
Emitter−Base Voltage
V_EBO −6.0 5.0
Vdc
Collector Current − Continuous
I_C
−150 150 mAdc
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic
(One Junction Heated)
Symbol
Max
Unit
Total Device Dissipation
T_A = 25°C
Derate above 25°C
P_D
187 (Note 1)
mW
256 (Note 2)
1.5 (Note 1) mW/°C
2.0 (Note 2)
Thermal Resistance −
Junction-to-Ambient
R_θJA
670 (Note 1)
490 (Note 2)
°C/W
Characteristic
(Both Junctions Heated)
Symbol
Max
Unit
Total Device Dissipation
T_A = 25°C
Derate above 25°C
P_D
250 (Note 1)
mW
385 (Note 2)
2.0 (Note 1) mW/°C
3.0 (Note 2)
Thermal Resistance −
Junction-to-Ambient
R_θJA
493 (Note 1)
325 (Note 2)
°C/W
Thermal Resistance −
Junction-to-Lead
R_θJL
188 (Note 1)
208 (Note 2)
°C/W
Junction and Storage Temperature T_J, T_stg −55 to +150
°C
1. FR−4 @ Minimum Pad
2. FR−4 @ 1.0 x 1.0 inch Pad
www.onsemi.com
(3)
(2)
(1)
Q₂
Q₁
R₂
R₁
(4)
(5)
(6)
4
5
6
23
1
SOT−363
CASE 419B
STYLE 1
MARKING DIAGRAM
6
71 M G
G
1
71 = Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package Shipping^†
NSTB60BDW1T1G SOT−363 3000 / Tape &
(Pb−Free)
Reel
NSVTB60BDW1T1G SOT−363 3000 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2015
1
March, 2015 − Rev. 4
Publication Order Number:
NSTB60BDW1T1/D